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东莞选择优质的美国贝格斯导热垫片就选GapPadHC3.0

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核心提示:Bergquist GapPadHC3.0柔软有基材间隙填充导热材料材料生产商:美国贝格斯(BERGQUIST)公司研发产品GapPadHC3.0可供规格:厚度(
  

Bergquist GapPadHC3.0柔软有基材间隙填充导热材料

材料生产商:美国贝格斯(BERGQUIST)公司研发产品

GapPadHC3.0可供规格

厚度(Thickness)0.25mm 0.51mm 1.02mm 1.52mm 2.03mm 2.54mm 3.18mm

片材(Sheet)8”×16”(203×406 mm)

卷材(Roll)

导热系数(Thermal Conductivity)3.0W/m-k

基材(Reinfrcement Carrier)玻璃纤维

胶面(Glue)双面自带粘性

颜色(Color)蓝色

包装(Pack)美国原装进口包装

抗击穿电压(Dielectic Breakdown Voltage)(Vac):>5000

持续使用温度(Continous Use Temp):-60°~200°

GapPadHC3.0应用材料特性:

GapPadHC3.0在非常低的压力下,低的S系列热阻,高的贴服性,S系列软度。针对低应力应用设计

玻纤增强,提高加工性能和搞斯裂性

GapPadHC3.0材料应用:

处理器,服务器S-RAMS,大容量存储驱动器,有线/无线通讯硬件,笔记本电脑,BGA封装,功率转换器

GapPadHC3.0技术优势分析:

GapPadHC3.0导热界面材料系列以更好的贴服性,更高的导热性能及易于应用来满足电子工业对导热界面材料的日益增长的需要;在凹凸不平的表面,空气间隙和表面粗糙的散热器与电子元器件之间,广泛的GapPadHC3.0提供一个有效的导热界面。

Gap Pad® HC 3.0 is a soft and compliant gap filling material with a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly. Gap Pad® HC 3.0 maintains a conformable nature that allows for quick recovery and excellent wet-out characteristics, even to surfaces with high roughness

and/or topography.

Gap Pad® HC 3.0 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. Gap Pad® HC 3.0 is supplied with protective liners on both sides.

 
关键词: GapPadHC3.0
 
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